• 100% test of the FPCplus during production and at the end of the process chain
  • Process monitoring is a TOP priority for us!
  • Validated crimping technology
  • SMD placement
  • OEM material and process approval
FPCplus
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View processes in detail

Today we face the challenge of responding to very diverse interfaces. To this end, we have developed a comprehensive, series-tested process portfolio over the years.

From fully automatic crimping with crimp force monitoring and SMD reflow soldering, from automatic placement to all-encompassing LED colour/light intensity testing - we always find a solution.

The portfolio of the FPCplus ranges form A to Z:

CONNECTING TECHNOLOGIES

  • Crimping
  • Crimping process monitoring
  • Connectors housing mounting
  • FPC/FPC through connection
  • Riveting
  • Clinching
  • Adhesive technologies
  • Corona treatment

SOLDERING/WELDING TECHNOLOGIES

  • SMD placement
  • Solder paste depot
  • Induction soldering
  • Selective soldering
  • Laser soldering
  • Reflow soldering
  • Lead-free soldering
  • Resistance soldering


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